IPM, PIM and TM-PIM: Different power modules for different applications

Emerging applications for electric motors require power electronics to become more efficient, more resilient against environmental influence and less error-prone. For each specific design there is a type of packaging technology fitting best to its needs.

Intelligent Power Modules (IPM)
Power Integrated Modules (PIM)
Transfer Moulded – Power Integrated Modules (TM-PIM)

Discover in our Webinar presented by ON Semiconductor how a new packaging approach can make the difference for your design.

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PRODUCTS

ON Semiconductor DIP-26 Transfer Molded Power Integrated Modules

ON Semiconductor DIP-26 1200V Transfer Molded Power Integrated Modules (TMPIMs) are IGBT Power Modules in Converter-Inverter-Brake (CIB) and Converter-Inverter (CI) configurations.

SPEAKER

Didier Balocco

Technical Marketing Manager for Power Applications

Didier Balocco received his engineering degree from the "École Nationale Supérieure d’Électronique et de RadioÉlectricité de Bordeaux", France in 1992 and his Ph.D. degree in Power Electronics from the University of Bordeaux in 1997. In 1996, he joined AEG Power Solutions, formerly Alcatel Converters, as a research engineer for DC/DC and AC/DC converters design in a range of 1 W to 1 kW mainly for telecom equipment. He managed the research activities from 2000 to 2014. He published more than 10 papers on power electronics and holds 1 patent. From 2011 to 2013, he worked 18 months on a 15-kW solar inverter module for a 150-kW solar inverter cabinet in Dallas, Texas, USA.

He joined Fairchild Semiconductor in August 2014 as a field application engineer (FAE) supporting South of France, Spain and Portugal. In 2016, ON Semiconductor acquired Fairchild. In 2018, he moved to a new role inside ON. He is currently a Technical Marketing Manager for Power Applications.